Wire bonding is a method used to connect the tiny wires inside electronic devices, such as semiconductors and integrated circuits, to their external connections. This process involves using a fine wire, often made of gold or aluminum, which is bonded to the chip and the package. The bonding is typically done using heat and pressure, creating a strong electrical connection. Wire bonding is essential for ensuring that electrical signals can travel efficiently between components, contributing to the overall performance and reliability of electronic devices.