Die Attach is a crucial process in semiconductor manufacturing where a small chip, known as a die, is attached to a substrate or package. This step ensures that the die is securely mounted, allowing for electrical connections to be made. The attachment is typically done using materials like epoxy or solder, which provide both mechanical support and electrical conductivity. The Die Attach process can significantly impact the performance and reliability of electronic devices. Proper attachment helps in heat dissipation and protects the die from physical damage. Various techniques, such as wire bonding or flip chip, are employed to achieve optimal results in different applications.