Ball bonding is a method used in semiconductor manufacturing to connect tiny wires to electronic components. This process involves using a small ball of gold or aluminum at the end of a wire, which is heated and pressed onto a bonding pad. The heat and pressure create a strong electrical connection. This technique is commonly used in the assembly of integrated circuits and microchips. It is favored for its reliability and efficiency, allowing for the production of compact and high-performance electronic devices. Ball bonding is essential for ensuring that electrical signals can travel effectively within these components.