Flip Chip is a technology used in electronics to connect a microchip directly to a circuit board. Instead of using traditional wire bonding, the chip is flipped upside down, allowing its solder bumps to make direct contact with the board. This method improves performance and reduces the size of the overall package. This technique is commonly used in high-performance applications, such as in computers, smartphones, and LED displays. By minimizing the distance between the chip and the board, Flip Chip enhances electrical performance and thermal management, making it a popular choice in modern electronic designs.