Dry etching is a process used in semiconductor manufacturing to remove layers from a material's surface. Unlike wet etching, which uses liquid chemicals, dry etching employs gases or plasmas to achieve precise material removal. This technique allows for better control over the etching process, making it ideal for creating intricate patterns on silicon wafers. The dry etching process typically involves exposing the material to reactive gases, which interact with the surface to form volatile byproducts that can be easily removed. This method is essential for producing microelectronic devices, as it enables the fabrication of fine features required for modern integrated circuits.