Plasma etching is a process used in semiconductor manufacturing to remove layers from the surface of materials. It involves creating a plasma, which is a state of matter made up of ionized gases, that reacts with the material to selectively etch away specific areas. This technique is essential for creating intricate patterns on silicon wafers used in microelectronics. During plasma etching, gases are introduced into a chamber where an electric field generates the plasma. The reactive ions and radicals in the plasma interact with the material, breaking chemical bonds and allowing for precise material removal. This method is crucial for producing integrated circuits and other electronic components.