Thermal Interface Material (TIM) is a substance used to enhance the thermal connection between two surfaces, typically in electronic devices. It fills microscopic gaps and irregularities, improving heat transfer from components like microprocessors to heat sinks or other cooling solutions. This helps maintain optimal operating temperatures and prevents overheating. Common types of TIM include thermal pastes, thermal pads, and phase change materials. Each type has unique properties suited for different applications, such as ease of application or thermal conductivity. Proper selection and application of TIM are crucial for the performance and longevity of electronic systems.