Wire bonding is a method used to connect tiny wires, typically made of gold or aluminum, to semiconductor devices. This process creates electrical connections between the chip and its package, allowing the device to function properly. Wire bonding is essential in the manufacturing of integrated circuits and microelectronics. The technique involves using a specialized machine that heats and presses the wire onto the bonding pads of the chip and the package. This creates a strong bond that can withstand various environmental conditions. Wire bonding is widely used in the electronics industry due to its efficiency and reliability.