A "flip chip" is a type of semiconductor packaging technology where a microchip is flipped upside down and directly attached to a circuit board. This method allows for a smaller footprint and better electrical performance compared to traditional packaging methods. The chip is connected to the board using tiny solder bumps, which provide a strong electrical and mechanical connection. This technology is commonly used in various electronic devices, including smartphones, computers, and tablets. By using flip chip technology, manufacturers can create more compact and efficient designs, leading to improved performance and reduced production costs.