A Ball Grid Array (BGA) is a type of surface-mount packaging used for integrated circuits. It consists of an array of small solder balls arranged in a grid pattern on the underside of the chip. These solder balls connect the chip to the circuit board, allowing for efficient electrical connections and heat dissipation. BGAs are popular in modern electronics due to their compact size and ability to support high pin counts. They are commonly found in devices like smartphones, computers, and gaming consoles, where space is limited and performance is crucial.