Chip packaging refers to the process of enclosing semiconductor chips in protective materials to ensure their functionality and durability. This packaging serves multiple purposes, including protecting the chip from physical damage, moisture, and contaminants, while also providing electrical connections to the circuit board. There are various types of chip packaging, such as dual in-line packages (DIP), surface mount technology (SMT), and ball grid array (BGA). Each type has its own advantages and is chosen based on factors like size, performance, and application requirements. Proper packaging is essential for the reliability and efficiency of electronic devices.