dual in-line packages (DIP)
A dual in-line package (DIP) is a type of electronic component housing that features two parallel rows of pins. These pins allow the DIP to be easily inserted into a circuit board, making it a popular choice for integrated circuits and other electronic devices. DIPs come in various sizes and pin counts, accommodating different types of components.
DIPs are commonly used in microcontrollers, memory chips, and other semiconductors. Their design facilitates easy soldering and replacement, which is beneficial for prototyping and repairs. Despite the rise of surface-mount technology, DIPs remain widely used in educational settings and hobbyist projects.