A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. It features an array of small solder balls arranged in a grid pattern on the underside of the package. This design allows for a more efficient connection to the circuit board, improving electrical performance and thermal management. BGAs are commonly used in various electronic devices, including computers and smartphones. They provide a compact footprint and can accommodate a higher pin count compared to traditional packages. This makes them ideal for modern applications that require high-density connections, such as microprocessors and graphics chips.