ball grid arrays
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. It features an array of small solder balls arranged in a grid pattern on the underside of the package. These solder balls connect the chip to the printed circuit board (PCB) when heated, allowing for a secure electrical connection.
BGAs are popular in modern electronics due to their compact size and ability to support high pin counts. They provide better thermal and electrical performance compared to traditional packages, making them suitable for advanced applications in devices like smartphones, computers, and gaming consoles.