A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. It consists of a grid of small solder balls on the underside of the package, which connect the chip to the circuit board. This design allows for a higher density of connections compared to traditional packages, making it suitable for modern electronics. BGAs are commonly used in various devices, including computers, smartphones, and gaming consoles. The solder balls provide a reliable electrical connection and help dissipate heat, improving the performance and longevity of the component. This packaging method is essential for the miniaturization of electronic devices.