Electromigration is a physical phenomenon that occurs in electrical conductors, particularly in microelectronics. It involves the movement of metal atoms within a conductor due to the flow of electric current. Over time, this movement can lead to the formation of voids or hillocks, which can compromise the integrity of the conductor and potentially cause circuit failure. This effect is especially significant in small-scale devices, where the dimensions of the conductors are reduced. As a result, electromigration can limit the lifespan and reliability of components like integrated circuits and semiconductors, making it a critical consideration in the design and manufacturing of electronic devices.