Thermal Interface Materials (TIMs) are substances used to enhance the thermal connection between two surfaces, typically in electronic devices. They fill microscopic gaps and improve heat transfer, ensuring that heat generated by components like microprocessors is efficiently dissipated. This helps maintain optimal operating temperatures and prevents overheating. Common types of TIMs include thermal pastes, thermal pads, and phase change materials. Each type has unique properties suited for different applications, such as ease of application or thermal conductivity. Proper selection and application of TIMs are crucial for the performance and longevity of electronic systems.