Socket LGA 774
The Socket LGA 774, also known as Socket J, is a CPU socket designed by Intel for their multi-core processors. It supports the Intel Xeon series, primarily used in servers and workstations. This socket features a land grid array design, where pins are located on the motherboard rather than the CPU, allowing for better heat dissipation and stability.
Introduced in 2006, the LGA 774 socket supports various Intel technologies, including Intel Virtualization Technology and Intel SpeedStep Technology. It is compatible with processors that have a thermal design power (TDP) of up to 120 watts, making it suitable for high-performance computing tasks.