BGA, or Ball Grid Array, is a type of surface-mount packaging used for integrated circuits. It features a grid of solder balls on the underside of the package, which allows for a more compact design and improved electrical performance compared to traditional packages. BGA is commonly used in various electronic devices, including computers and smartphones. The BGA design helps distribute heat more evenly and provides better mechanical stability. This packaging method is particularly beneficial for high-density applications, as it allows for a greater number of connections in a smaller area. Overall, BGA technology plays a crucial role in modern electronics.