3D Stacking is a technology used in electronics to arrange multiple layers of components vertically. This method allows for a more compact design, saving space on circuit boards while improving performance. By stacking chips or memory modules, manufacturers can create smaller devices without sacrificing functionality. This technique is commonly used in semiconductors and memory storage, such as 3D NAND flash memory. It enhances data transfer speeds and increases storage capacity, making it ideal for smartphones, tablets, and other portable devices. Overall, 3D stacking contributes to the advancement of modern electronics by optimizing space and efficiency.